R&D Technician (Semiconductor/Shift)

Job Responsibilities: 

• Operate lithography equipment and perform related measurements to support panel UHD advanced packaging development.
• Analyze metrology data for equipment setup and process performance, and make decisions based on SPC and OCAP guidelines.
• Support DOE activities, engineering runs, and process characterization.
• Carry out routine equipment maintenance, respond to machine alarms, and perform recovery actions.
• Operate and take ownership of lithography-related tools.
• Perform tool setup, daily inspections, preventive maintenance (PM), and basic calibration.
• Troubleshoot and resolve common equipment issues.
• Support the installation, qualification, and ramp-up of new tools.

Job Requirements: 

• Diploma / ITE / Technical certification in Electrical / Mechanical / Mechatronics Engineering, Materials Science, Semiconductor Manufacturing or related discipline.
• 1–5 years of experience with Lithography tools in semiconductor fab environment or wafer/panel level packaging, coating, exposure, developing, baking, thickness, CD, and overlay measurement tools.
• Basic understanding of semiconductor wafer processing and cleanroom practices
• Basic knowledge of SPC, MSA and inspection process capability
• Experience supporting R&D, pilot line, or NPI (New Product Introduction) is a plus. 

We regret that shortlisted candidates will be notified.

Name: Teoh Xue Ling

Registration No.: R22107190

EA License No.: 02C3423