Product Specialist - Thermal Compression Bonding

Product and Technical development Support

Lead and support for Thermal Compression (TCB) product setup & demo
Conducts feasibility studies, sample bonding and generate report
Builds-up technical know-how on product/problem solving via structured knowledge transfer between the on-site support team, the Product Line and the R&D team
Defines DOE’s and experimental process trials & collects Process Data
Scouts and reports new product ideas and innovation with the goal to enhance the product related to thermal compression bonding
Understands the Thermal compression bonding process and knowhow to actual bonding process
Understands the different process for thermal compression bonding (C2S, C2W, Flux or Fluxless)
Acquires knowledge on pre and post die bonding processes
Provides suggestions based on analysis of results, knowledge
collection from papers/journals/books/publications and customer
discussions to improve process or provide solutions to problems
Engages in R&D projects during product definition / requirement engineering, SW test and customer product testing
Deep dive and troubleshoot process related or equipment related to issues and suggest improvements in HW design/SW logic
Defines SW requirements for new modules and features/Process sequence and Data/information exchange with different stakeholders.

Pre- & After Sales Support

Conducts evaluations, demos and generate test report and instructions
Support Sales and CPMs during Pre-Sales and demo activities
Establishes good customer relationship on technical level with key accounts assigned
Provides Technical Info to CPMs/Sales and/or product group.
Collects process / production / competitor data at customer site

Technical Support, 2nd Level support

Coordinates and provides technical solutions / problems solving on customer issues in collaboration with Field Service Engineer
Investigates issues at customer site and supports Engineering team for fast and short time to solution
Conducts training to FSE’s and Customers

Education : 
Degree/Masters in Mechanical/Electrical/Electronics or Mechatronic Engineering

Work experience
Minimum 5 years of experience in a complex Technical environment and 3 years in Product Support environment & RnD support
Hands-on experience in Thermal compression bonders (TCB), Flip Chip and advance packaging Process and equipment’s

Expertise and methodology
Matlab, JMP and statistical data analysis skills desirable
Travel readiness