System Engineer - Die Bonding

Systems & Process Engineering

- Participation in the development of hardware and software modules of "Die Bonder" equipment for the semiconductor industry (analysis, modelling, calculation, measurement, qualification)

- Definition of hardware and software requirements for an interdisciplinary development team (mechanics, electronics, software, motion control)

- Conduct and analyze experiments in order to identify suitable system parameters and machine production sequences

- Optimization of the Die Bonder system with the focus on accuracy, stability and productivity

- Development of "Die Bonding" process technologies according to current or future customer requirements (analysis, modelling, calculation, measurement)

Customer Support

- Support internal and external customers (occasional business travel)

- Support product management on customer projects

- Support manufacturing engineering on assembly and supplier issues

Knowledge Management

- Interpretation, documentation and presentation of new results

 

Education

- Technical education at university. Ideally microsystem technology, mechanical, electrical or mechatronic.

Experience

- Work experience in semiconductor or mechanical/electrical engineering or in a related field is advantageous

Expertise

(Business knowledge, MS-Office, etc.)

- Expertise in mathematics, mechatronic or material science

- Flair for practical work in the lab and with experience with measurement equipment

- Microsoft office and programming knowledge

Personal Compentences

(Social skills, management experience or strategic awareness, etc.)

- Capacity for teamwork as well as initiative and personal responsibility

- Innovative, systematic and solution-oriented work approach

- Flexible and able to work under pressure

- Ability to present complex topics in appropriate ways for specific audiences

Other requirement criteria

- Knowledge, experience and practice on ESG initiatives