Process Engineer (Wafer Bumping/Soldering/Kallang/Contract)

Location Singapore
Discipline Engineering
Job Reference BBBH106551_1636121162
Salary S$4000 - S$6000 per month
Consultant Email apple.lim@manpower.com.sg
EA License No. 02C3423


Process Engineer (Wafer Bumping/Soldering/Kallang/Contract)

12 Months Contract
Location: Kallang
Salary: Up to $6000 depending on experience
Contract Bonus
Company Transport Provided (Aljunied / Toa Payoh)

Our client develops and manufactures innovative RFFE filtering solutions for mobile devices and fast-growing business segments, such as IoT, drones, robotics, automotive applications and more. Currently, they are looking for 12-Months Contract Process Engineer to join their teams.

Responsibilities:

  • Oversees the evaluation, development and optimization of new processes in the area of bumping
  • Perform evaluation on material using experimental design, statistical method and material analysis to implement a quality and robust engineering solution.
  • Innovative approach to reinvent current bumping processes, materials and/or technology.
  • To conduct FMEA with cross functional teams for the introduction of new technology, tools and processes.
  • To stay updated on the latest technologies, business trends and roadmaps via seminars, conferences, external institutes, etc.
  • Engage actively with vendors to keep up to date on new technology and products.



Requirements:

  • Bachelor's degree and above in Mechanical, Electrical, Electronics or Material Engineering disciplines.
  • Work experience in a high-volume manufacturing environment preferably in Semiconductor manufacturing in a similar capacity.
  • Experience in wafer bumping/solder bumping technology



If you possess above relevant skillsets, please send in your updated CV in word format to Apple.lim@manpower.com.sg

Lim Pey Chyi
Recruitment Consultant (R2090579)
Manpower Staffing Services (S) Pte Ltd
EA Licence: 02C3423

Apple, Pey Chyi Lim EA License No.: 02C3423 Personnel Registration No.: R2090579

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