Product Specialist, Hybrid Bonder

Location Singapore
Discipline Engineering
Job Reference BBBH135215_1705373653
Salary AWS + Variable bonus
Consultant Email joanna.tham@experisitperm.sg.manpowersg
EA License No. 02C3423


Technical Product Management

  • Collaborate with R&D in defining new features and CIP requirements, both software and hardware
  • Participation in the development of new or the extension of existing
  • Hardware and Software modules according to current or future customer requirements (Analysis, modelling, calculation, measurement, qualification)
  • Carry out internal acceptance test of new features and CIP developed by
  • R&D like software or new hardware module and CIP items.
  • Defines SW requirements (JIRA) for new modules and features
  • (Requirement Engineering) and regular update JIRA status.
  • Scouts and reports new product ideas and innovation with the goal to enhance the product and service portfolio.
  • Engages in R&D projects during product definition / requirement engineering, In-house and at customer site testing.
  • Conducts feasibility studies and sample bonding on customer material.
  • Builds-up good technical know-how on product / problem solving via structured knowledge transfer between the Product Line, the R&D team, and the different regional support centers.
  • Provides support for Hybrid bonder product introduction (launching, demo, Semi shows)


Pre & After Sales Support

  • Conducts evaluations, benchmarks, and demo wafers/Feasibility studies.
  • Support Sales and CPMs during Pre-Sales activities
  • Establishes good customer relationship on technical level with all key accounts assigned.
  • Provides Technical Info and Updates to CPMs and Sales Technical Support, 2nd Level support.
  • Coordinates and provides technical solutions / problems solving on customer issues in collaboration with Field Service Engineer in Asia (2nd level support)
  • Investigates issues at customer site and supports Engineering team (Software & Hardware) for fast and short time to solution.


Know How Transfer

  • Troubleshoots and maintains demo equipment if necessary.
  • Conducts training on existing and future Hybrid bonder to FSE's and customers.
  • Supports Documentation and Manual writing activities.



Qualifications

  • Degree or master's in mechanical, Electrical engineering or Information Technology
  • Minimum 5 years of experience in a complex technical environment, 3 years in Product Support environment with customer engagement
  • Experience within Semiconductor backend or Front-end Industry
  • Comprehensive experience on Datacon 8800 platform is a plus.