R&D System Engineer (Hybrid Bonding)

Location Singapore
Discipline Engineering
Job Reference BBBH134875_1705390687
Salary AWS + Variable bonus
Consultant Email joanna.tham@experisitperm.sg.manpowersg
EA License No. 02C3423


Process Development and Support

  • Collects Process Data related to Hybrid Bonding
  • Defines DOE and experimental process trials
  • Documents and prepares reports
  • Understands the different scenarios for Hybrid bonding (die to wafer, collective die to wafer, wafer to wafer)
  • Understands the process from Physics/Chemistry point of view
  • Acquires knowledge on pre and post die bonding processes, in particular cleaning, plasma activation and annealing.
  • Provides suggestions based on analysis of results, knowledge collection from papers/journals/books/publications and customer discussions to improve the process or provide solutions to problems.
  • Aware and understands different customer needs and priorities
  • Machine & Applications Support


Machine installation and calibration

  • Machine Application Setup
  • Defines Tooling and Collaterals together with Engineer team
  • Prepares and executes customer demos and sample builds


Point-of Contact Support

  • Data and information exchange with different stakeholders
  • Roll out of new software, features set and modules


Requirements:

  • Master or PhD in Physics, Semiconductor or Electronics
  • Minimum 5 years of experience in a complex Technical environment, 3 years in R&D environment
  • Experience within semiconductor front and backend process
  • Experience in production environment an added plus
  • Excellent Metrology knowledge, as well as Material & Semiconductor Physics topics
  • Matlab, JMP and statistical skills desirable
  • Programming/ scripting skills such as Python is desirable

Joanna Tham Pooi Kwan EA License No.: 02C3423 Personnel Registration No.: R1985398