- Participation in the development of hardware and software modules of "Die Bonder equipment for the semiconductor industry (analysis, modelling, calculation, measurement, qualification)
- Definition of hardware and software requirements for an interdisciplinary development team (mechanics, electronics, software, motion control)
- Conduct and analyze experiments in order to identify suitable system parameters and machine production sequences
- Optimization of the Die Bonder system with the focus on accuracy, stability and productivity
- Development of "Die Bonding" process technologies according to current or future customer requirements (analysis, modelling, calculation, measurement)
- Customer Support
- Support internal and external customers (occasional business travel)
- Support product management on customer projects
- Support manufacturing engineering on assembly and supplier issues
- Knowledge Management
- Interpretation, documentation and presentation of new results
Education
- Technical education at university. Ideally microsystem technology, mechanical, electrical or mechatronic.
Experience
- Work experience in semiconductor or mechanical/electrical engineering or in a related field is advantageous.
Expertise
- Expertise in mathematics, mechatronic or material science
- Flair for practical work in the lab and with experience with measurement equipment
- Microsoft office and programming knowledge
Personal Compentences
- (Social skills, management experience or strategic awareness, etc.)
- Capacity for teamwork as well as initiative and personal responsibility
- Innovative, systematic and solution-oriented work approach
- Flexible and able to work under pressure
- Ability to present complex topics in appropriate ways for specific audiences
Joanna Tham Pooi Kwan EA License No.: 02C3423 Personnel Registration No.: R1985398
