Product and Technical Development Support
- Provides support for Thermal Compression (TC) product setup & demo
- Conducts feasibility studies, sample bonding and generate report
- Builds-up good technical know-how on product/problem solving via structured knowledge transfer between the on-site support team, the Product Line and the R&D team
- Defines DOE's and experimental process trials & collects Process Data
- Scouts and reports new product ideas and innovation with the goal to enhance the product related to thermal compression bonding
- Understands the Thermal compression bonding process from Physics/Chemistry point of view and relate to actual bonding
- Acquires knowledge on pre and post die bonding processes
- Provides suggestions based on analysis of results, knowledge collection from papers/journals/books/publications and customer discussions to improve process or provide solutions to problems
- Engages in R&D projects during product definition / requirement engineering, SW test and customer product testing
- Understands the different process for thermal compression bonding (C2S, C2W, Flux or Fluxless)
- Deep dive and troubleshoot process related or equipment related to issues and suggest improvements in HW design/SW logic
- Defines SW requirements for new modules and features/Process sequence and Data/information exchange with different stakeholders.
- Collects process / production / competitor data at customer site
- Supports SOP, technical documentation and product operating manual writing activities and publish BKM
Pre- & After Sales Support
- Conducts evaluations, demos and generate test report and instructions
- Support Sales and CPMs during Pre-Sales and demo activities
- Establishes good customer relationship on technical level with key accounts assigned
- Provides Technical Info to CPMs/Sales and/or product group.
Technical Support, 2nd Level support
- Coordinates and provides technical solutions / problems solving on customer issues in collaboration with Field Service Engineer
- Investigates issues at customer site and supports Engineering team for fast and short time to solution
- Provide application support for internal & external customers
- Conducts training to FSE's and Customers
Requirements
Education
- Degree/Masters in Mechanical/Electrical/Electronics or Mechatronic Engineering
Work experience
- Minimum 5 years of experience in a complex Technical environment and 3 years in Product Support environment & RnD support
- Experience in production environment on Die attach/die bonding know how can be an asset
- Hands-on experience in semiconductor front end or backend Process and equipment
Expertise and methodology
- Good PC, MS-Office, AutoCad knowledge
- Matlab, JMP and statistical data analysis skills desirable
- Excellent wafer fab Front end/Backend Metrology knowledge
Other requirement criteria
- Very good analytical skills
- Excellent communication skills
- High level of assertiveness
- High degree of flexibility required
- Travel readiness up to Twenty-Five Percent
Frances Diana delos Santos, Manalo EA License No.: 02C3423 Personnel Registration No.: R1219552
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