Product Know How and Technical development Support
- Conduct Hybrid Bonder technical training programs and help trainee to develop the necessary skills to handle Hybrid Bonders.
- Improve and develop the standard training document with necessary adjustments especially for tailored courses per customer request.
- Provide technical subject matter expertise. Ensures consistency of Technical Training Programs within company objectives.
- Conduct Hybrid Bonder and process training in house and at customer sites, focusing on specialized / customized courses.
- Technical Knowledge and Troubleshooting skills on bonder HW modules, process output responses etc.
- Understand the Hybrid bonding process and relate to actual product bonding fingerprints.
- Support SOP, technical documentation and product operating manual writing activities and publish BKM.
- Build-up good technical know-how on product/problem solving via structured knowledge transfer between the on-site support team.
- Able to support post bond analysis like SAM, OVL measurement etc.
- Conduct evaluations, demos and generate test reports and instructions.
Requirements
Education
- Degree/Masters in Mechanical/Electrical/Electronic Engineering
Work experience
- Minimum 5 years of experience in a complex technical environment and 3 years in Product Support environment or technical training.
- Hands on experience in 8k8 Flip chip, Die attach or other Besi product line.
Expertise and methodology
- Good PC, MS-Office, AutoCad knowledge.
- Possess solid technical aptitude, excellent communicator and able to explain complex subjects in a clear and interesting way.
- Excellent wafer fab Front end/Backend Metrology knowledge
Frances Diana delos Santos, Manalo EA License No.: 02C3423 Personnel Registration No.: R1219552
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